Features

• Compact heads

• High responsive Z-axis structure reduces tact time to 0.22 sec/chip under optimal condition.
• The simple structure of the rotational axis’ Direct Drive Theta mechanism had improved reliability and made the system free of A/S requirement.

• None contact of centering system

• Can handle up to 1005 (chips) ~ 32mm QFPs.
• High accuracy detection through collecting information on pick-up posture using Line CCD (Pixel size: 0.017mm) and gray scale image processing.
• Diversified component identifying system, such as BOB (Block On Body) and BOL (Block On Lead) inspection.
• None contact centering system has minimized component damage to zero level.
• High speed/high accuracy calibration of positioning and angle slip of picked component.
• Mounting system optimized to reduce component loss rate and to promote mounting reliability.

• Image sensing vision unit (CP 40LV)

• BGA (Ball inspection: 42? 42mm, 1.0mm pitch), connector
• QFP: 42? 42mm, 0.5mm pitch
• QFP: 32? 32mm, 0.3mm pitch (Option)
• Easy to setup at the optimal position on the feeder base
• Image processing time for vision recognition: 1.3 sec.
• High precision recognition realized by carrying out 256-stage gray scale image processing.

BODY

• Slim type tape feeder

• Pneumatic cylinder operated system, capable of accommodating maximum 104 pieces of 8mm tape feeder.

• High speed nozzle changer

• High speed nozzle changing minimizes loss time.
• Up to 16 types of nozzle pockets makes this applicable for variety of shapes and of component.

• World’s fastest tack time in the class

• 0.22 sec/chip (16300CPH); optimal conditions (3-head simultaneous pick-up / individual mounting)

• Feeder floating detector

• If the photo sensor detects floating of the Tape Feeder, operation of the machine is stopped.

• 3-stage conveyor system (Option)

• PCB under side fixing system offers improved PCB flatness.
• 3-stage structure minimize PCB transport time.
• Handle wide variety of PCBs, ranging from 50? 30mm to 460? 400mm.
• Without taking the feeder’s space.

• Dual CPU structure

• Data can be edited during work by operating the data processor and system drive unit by a separate CPU.
• Operating rate maximized through the use of a CPU designated for the system operation.

• Safety interlock function

• In case the front or rear acrylic cover is opened, or if air pressure is low, the machine is stopped to protect operators and equipment.

SOFTWARE

• Off-line program ( Option)

• CAD interface: CADSTAR, MENTOR, ZUKEN, GRVER, ASCII data and others.
• Digitizer interface: Summer Sketch III-series, WACOM II-series.
• Mounting sequence, feeder arrangement optimizer
• Line balancing program

• Convenient work environment based on WINDOWS 95.

• User friendly Windows 95 based software.
• Hardware is composed of a 14?VGA color monitor, a 3.5?FDD, a keyboard, a HDD (1.2GB) and a mouse.
• Error can be checked easily by displaying error on screen.
• Productivity optimized through auto programming.
• Fast S/W upgrade (using communication networks)
• Production management and line control made easy by mounting all data into data base.

• The industries first remote service system.

• Diagnose the machine and take remedial action via public network
• Immediate upgrading of S/W without the need of separate isntallation.

• Multi-function vision head

• Able to select the applicable head according to the components
• One dedicated vision head for odd shape/large components.
• Two non-contact line CCD head for chips/ICs.
• Gripper nozzle installed for component which are difficult to be picked-up by vacuum (large connectors, coils, transformers)
• Variety of components with thickness up to 15mm can be mounted.

• Multi-function vision system

• Multiple field of recognition function facilitates processing of large components.
• 2-division/4-division recognition
• QFP: 55? 55mm (0.5mm pitch)
• BGA (ball inspection), 75mm width connector.
• Odd shape components recognition function.
• Expanded fiducial mark processing capability

• Intelligent lighting system

• Multiple lighting system: reflective, through beam & side lighting accurately responding to special components such as white connector, BGA.
• Automatic recognition/reproduction function featuring optimal lighting environment.

• Head mechanism designed for high-precision mounting.

• Highly durable / accurate Z-axis structure (rack and pinion system).
• High reliability and easy maintenance realized through simplicity of rotation axis-(? ) direct drive mechanism.

• Non-contact centering system

• Can handle from 1005(0402) chip ~ 32mm QFPs.
• Zero components damage via non-contact centering system.
• 0.85 sec/QFP tact time based on On-The-Fly centering system (Optimal conditions)

• Direct drive theta

• The simple structure of the rotational axis’ direct drive theta mechanism has improved reliability and made the system free of A/S requirement.

• 3-stage conveyor system

• PCB under-side fixing system offers improved PCB flatness.
• 3-stage structure minimizes PCB transport time.
• Handle wide variety of PCBs, ranging from 50? 30mm to 460? 400mm.

• High-precision nozzle

• Handle variety of components minimizing the loss time of changing nozzles.
• Fixed key-home structure prevents component rotating.
• Titanium plating ensures high durability.
• Inside-spring cap structure ensures mounting stability.

• Auto nozzle changer (ANC)

• Gripper nozzle can be changed at its two pockets ANC.
• Up to 20 types of nozzle pockets makes this applicable for a variety of shapes and components.

Specification