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17425 S. Laflin Ave. · P.O. Box 155 · East Hazel, IL 60429-0155
PH: 708/798-8300 · Fax: 708/798-8924
Singapore · England · Australia · Norway  

HI-GRADE #1081-HF HALIDE FREE ORGANIC SOLDERING FLUX

Description

Hi-Grade #1081 Halide - Free Organic Soldering Flux is a specially formulated material for soldering copper, nickel, nickel-plated and Kovar base metal. This flux has a wide temperature range and it is suitable for all conventional tin-lead and low temperature alloys. Hi-Grade #1081 Halide - Free Organic Soldering Flux exhibits excellent solderability with lowest ionic residues after aqueous cleaning.

Uses

Hi-Grade #1081 Halide-Free Organic Soldering Flux was developed for use in various electronic soldering applications where halide-type organic fluxes are too corrosive and rosin fluxes are too inactive. It is used in soldering copper, nickel, Kovar, tin-plated, nickel plated base metal.

Hi-Grade #1081 Halide-Free Organic Soldering Flux is suitable for soldering with all conventional tin. lead alloys. It is suitable for an soldering the following metals:

Sliver Brass Tin (Plate) Nickel
Solder (Plate) Gold Cadmium
Copper Tin-nickel (Plate) Bronze

The flux contains no potentially corrosive halides and produces good solder joints. The flux residue readily rinses away with cold or warm water.

Application

Hi-Grade #1081 Soldering Flux is especially adaptable to foam application. However, it can also be applied by brushing, dipping and spraying.

Residue Removal

A very small amount of residue is left behind on soldering and is completely soluble in water. The flux residue can be completely removed by cleaning in cold or warm water, or with detergent-based water cleaners. It is suggested that all residue be removed to attain a high degree of reliability.

Physical Properties

Physical state : Clear colourless solution
Specific Gravity @ 77 deg. F (25 deg. C) : 0.965 +/- 0.003
Flash point : 68 deg. F TCC
Percent non-volatile matter : 25.00 +/- 2.00
Residue : Soluble in water

pH

: 3.3 to 4.8

Precautions

Hi-Grade #1081 Soldering Flux can cause skin dehydration to certain individuals. Direct contact and continuous exposure should be avoided. In case of direct contact, always rinse the affected area with plenty of water.

Since this flux is flammable, direct heating, sparks or open flame should be avoided. The flux should always be stored in a dry, well-ventilated area.

Tinning

Dilution is seldom required. However, it is thinning should become necessary, it is suggested that Hi-Grade #16-1081 Thinner be used.

Packing

23 liters or     6 US gallon per container
209 liters or     55 US gallon per container

 


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Navanakorn Electronics Co., Ltd.
1233 Big Land Factory, Paholyothin Road KM. 46
Moo 13, T. Klongnueng, A. Klongluang, Pathumthani 12120, Thailand 
Telephone : +66 (2) 9081555   FAX : +66 (2) 9082262 
Contact us: nec@nec.itgo.com