HI-GRADE #158-UC SOLVENT CLEANER
Description
HI-GRADE #158-UC SOLVENT CLEANER is
designed for use in removing flux residues from printed circuit boards. The #158-UC is
comprised of a chlorinated solvent not contained on the list of ozone depleting chemicals.
Use of this solvent does not violate the mandates set forth in the CLEAN AIR ACT or the
MONTREAL PROTOCOL.
Benefits
- Effectively removes residue from rosin and synthetically
active soldering fluxes
- Does not contain solvents considered as ozone depleting
- Capable of absorbing large amounts of contaminants yet still
provide excellent cleaning
Application
The #158-UC can be user in vapour
degreasers, ultrasonic cleaners, or used at room temperature for removing rosin or
synthetically active residues.
Physical Properties
| Specific Gravity |
: 1.520 @ 60 deg. F |
Pounds per |
: 12.67 |
Boiling Point |
: 248 deg. F - 255 deg. F |
Flash Point |
: None |
Appearance |
: Clear liquid |
The #158-UC has compatibility
properties very much like 111 TRICHLOROETHAN. The following are some specific material
compatibility data:
MATERIAL COMPATIBLE
| POLYETHYLENE (XLPE, LDPE) |
YES |
| POLYPROPYLENE |
YES |
| VITON |
YES |
| POLYPHENYLENE SULFIDE |
YES |
| NYLON |
YES |
| EPOXY MATERIAL |
YES |
| POLYCARBONATE |
NO |
| POLYSULFONE |
NO |
NATURAL RUBBER |
NO |
This solvent is compatible with all
metals - The compatibility data given is for long-term, constant contact of the #158-UC
solvent cleaner with the material in question. Tests should be conducted to determine the
compatibility of all materials exposed to the cleaning process.
Packing
23 liters or 6 US gallon per container
209 liters or 55 US gallon per container
Safety And Precautions
Use with adequate ventilation. Always wear safety glasses
and protective clothing
