Description
HI-GRADE #677-MG H0T AIR LEVELLING FLUX is
a specially formulated fluid flux for use in hot-air solder levelling machines. It
exhibits exceptionally high temperature stability, thermal conductivity and complete water
solubility. It is designed to be used as shipped and not be diluted with any other
solvents.
Uses
HI-GRADE #677-MG HOT AIR LEVELLING FLUX is
used as flux in hot-air solder levelling machines and provides uniform solder-coating on
PC boards. This flux can be used on both vertical and horizontal machines and also
eliminates the need to use two fluxes - one for SMD boards and one for mixed technology
boards.
Applications
HI-GRADE #677-MG HOT AIR LEVELLING FLUX is
applied by dipping. The excess hot-air levelling flux is then removed. The boards are then
pre-heated and dipped in molten solder. The excess solder is then removed from the board
by blowing hot air as it leaves the solder pot. All of these steps are synchronised with
automatic machines and the equipment manufacturers' instructions should be carefully
followed to attain satisfactory results.
Special Advantages
- Very low ionic contamination levels
- No "hazing" and compatibility with all solder masks
- Absence of icicling and solder-webbing and spiking
- Prevents solder skips and misses
- Inhibits thermal shock during solder levelling process
- Enhances uniform coverage of solder on PC boards
Physical Properties
| Appearance |
: Viscous Liquid |
| Specific Gravity @ 72 deg. F |
: 1.08 +/- 0.02 |
Flash Point |
: 510 deg. F COC |
Packing
23 liters or 6 US
gallon per container
209 liters or 55 US gallon per container
Safety And Precautions
Hi Grade #677MG Hot Air Levelling Flux
should be used only with adequate ventilation. In case of skin contact, rinse affected
area immediately with soap and water. It is irritating to the eyes. If exposed, flood with
water immediately and get medical attention.
