INTRODUCTION
A halide-free, Water-Soluble solder paste formulated to accommodate a broad range
of environmental conditions. This product is mildly activated and exhibits
exceptional wetting when reflowed in air. In additions, it meets ANSI/J-STD-400 and
-500 specification as well as Bellcore specifications.
AVAILABLE ALLOYS
Various low oxide spherical composed of Sn-Pb-Ag and other alloys available upon request.
Typical metal loads range from 85% - 90% for standard alloy compositions.
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Solder Powder Diameter |
| Type |
Pitch |
Mesh Size |
Microns |
Inches |
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| 1 |
STD |
-100 +/- 200 |
75-150 |
.0030 - .0059 |
| 2 |
STD |
-200 +/- 325 |
45-75 |
.0018 - .0030 |
| 3 |
Fine |
-325 +/- 500 |
25-45 |
.0010 - .0018 |
| 4 |
Ultra - Fine |
-400 +/- 635* |
20-38 |
.0008 - .0015 |
* -400 +/- 500 also available |
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STENCIL MATERIAL
Stainless Steel, Brass or Nickle Plated
SQUEEGEE
80 - 90 shore A Durometer Rubber or Stainless Steel Blade
SQUEEGEE SPEED
25 mm. to 50 mm. (1.0" to 2.0") per second for typical fine pitch printing with
89 - 268 gms/cm (0.5 lb. to 1.5 lb.) pressure.
REFLOW METHODS
Convection, IR (Infra-Red), Vapor Phase etc.
RECOMMENDED PROFILE
This profile for use with Sn63Pb37 &
Sn62Pb36Ag2 alloys and will serve as a general guideline in establishing a reflow
profile for your process. Adjustment will be necessary for use with other alloys. Various
board geometries, densities, and oven types may require further profile adjustment.
The typical reflow profile encompasses four
basic stages:
1 Preheat : 0.5 degree C to 1.0 degree C/second rate of rise
2 Soak or Dryout : 30 - 60 seconds
3 Reflow : Peak temperature should be 30 to 40 degree C above the
liquidus of the alloy for 30 to 60 seconds.
4 Cool Down: <4 degree C/second.
CLEANING
The residue is easily cleaned with water at no less than 40 psi and 55 degree C. These
parameters are a function of board complexity and cleaner efficiency.
STENCIL CLEANING
This is best performed using isopropyl alcohol (IPA) as s solvent. Conventional cleaning
solvents, saponification, and other CFC-free alternatives are also effective.
SHELF LIFE, RECOMMENDED STORAGE AND
USE
6 months at 20 degree C to 21 degree C
Solder paste should be allowed to reach
ambient working temperature prior to use. Actual time reach thermal equilibrium will vary
with container size. In order to maximize the opened-jar paste performance, the paste
should be covered when not in use.
| Test |
Result |
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Test |
Result |
| J-STD-400 (IPC-TM-650) |
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J-STD-005 (IPC-TM-650) |
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| Flux Type Classification |
MO |
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Solder Paste
Viscosity |
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| Flux Induced Corrosion (Copper Mirror) |
Pass |
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(Sn63, 90%, -325/+50 mesh) |
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Presence of Halide
Silver Chromate
Fluoride Spot Test
Elemental Analysis (Br, Cl, F) |
Pass
Pass
0% |
|
Brookshield (5 rpm)
Malcom (10 rpm)
Thixotropic Index : SSF (ICA Test)
Slump Test |
950+/-100 kcps
3600+/-500 poises
-0.39+/-.010
Pass |
| Non-Volatile Content (Solid Content) |
86% |
|
Solder Ball Test |
Pass |
| SIR |
Pass |
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Tackiness |
37g |
| Electromigration |
Pass |
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Wetting Test |
Pass |
| Acid Value |
73 |
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