VSS-3B SMT B'd Soldering Inspection System
------Total solution for the SMT Board Inspection |
- VSS-3B is a visual inspection system which automatically detects various kinds
of mounting errors and soldering defects on SMT boards. With high speed and high accuracy
image processing technology, it performs in-line inspection of a wide variety of boards,
ranging from fine-pitch, high-density boards to low-density, large-sized boards. It
provides a total solution to enhance the productivity and the quality of SMT boards.
Features:
- High speed and accurate inspection regardless of the mount
density of boards. (0.25 sec/inspection area)
- High accuracy attained for high-density and fine-pitch
boards (e.g., 0805 chip, 0.4 pitch IC).
- Minimum standby time by off-line programming when applying
new boards.
- Reliable inspection regardless of the operator’s
proficiency using well-established inspection libraries.
- Perfect detection of various components with various
appearance defects.
- Easy check for defective components: defective points are
displayed on a monitor and marked on the board.
|
SPECIFICATION |
| ITEM |
SPECIFICATION |
Recognition
system |
Methodology |
binary/gray image processing |
| Illumination |
3-layered LEDs |
| Camera |
small FOV:
10*7.5mm(resolution: 20?m)
large FOV: 15*11.2mm(resolution: 30?m)
(adjustable according to the component size) |
Mechanical
system |
Position control |
Microprocessor controlled AC
servo |
| PCB size |
Min.50*70 - Max.250*330(mm) |
Component
Height |
Upper plane: max.20mm
lower plane: max: 15mm |
| Conveyor Width |
Manually adjustable |
| S/W |
O/S |
WINDOWS-NT |
| Storage Cap. |
More than 200 modules |
Inspection
Capacity |
Max 150Area/module
Max 20module(easily expandable) |
| Power |
Single phase 220V?10%,
50/60HZ |
| Air-pressure |
5kgf/cm2?1kgf/cm2 |
| Dimension |
L1000*W950*H1280(mm) |
| Weight |
800kg |
| Teaching |
Program |
on-line programming in the
system
off-line programming(dual mode: manual/automatic) |
| Edit |
Editable during the
inspection
off-line editing & testing |
| Time |
Manual teaching: 5
components/min (for chip components)
Automatic teaching: 30min/board |
| Inspection |
Component |
Chip component: large than
0805 size
LSI component: large than 0.4 pitch |
| Items |
component missing,
mis-alignment, inversed polarity, no solder , solder bridge, manhattan, turn over, lead
floating, crack, incorrect parts |
| Speed |
0.25 sec/inspection
area(regardless of mount density) |
| Loading |
Less than 6 sec(including
unloading) |
| NG Mark |
1.5 sec/NG point |
| Option |
1. off-line program builder
-generating an optimal path of robot motion
-automatic programming of inspection data using mounter data
2. J-type leaded IC inspection module |
