SOLDERING FLUXES
1 Rosin Fluxes
Hi-Grade rosin fluxes are formulated with high quality
purified Grade WW rosin conforming to LLL-R625 in specially blended systems. The flux
formula is based on the soldering application, desired rosin percentage, type of solvents
and activity level required. It conforms to MIL-F-14256 Specifications.
Non-Activated (R) Rosin Fluxes
HG 343
This flux is often required where Military
Specifications call for a non-active rosin flux.
Mildly Activated
(RMA) Rosin Fluxes
HG 2212
Designed to Military applications for very
sophisticated electronic circuitry. It also possess high thermal stability for soldering
on double and multi-layer boards. Solderability can almost equal that of most activated
rosin fluxes. Exposure to high preheat does not degrade solubility of the residue in
normal solvents.
Rosin Activated (RA)
Fluxes
HG 784
This flux uses extra high purity rosin which is free from conductive contaminants. It
enables instant wetting, fewer touch-ups and a non-tacky board surface.
HG 785-10
This is a specially formulated rosin-activated flux consisting of pure rosin blended with
a solvent system exhibiting excellent wetting power. The rosin used if off extra high
purity and free from conductive contamination.
HG 785-15
Similar to HG 785-10 but with higher solid content for higher wetting power.
2 Organic Water Soluble Soldering Fluxes
Organic fluxes generally provide greater fluxing ability than rosin flux, but the
ionizable nature of the water soluble residue make organic fluxes too conductive and
corrosive to leave on electronic assemblies. Because the flux residues can be easily
removed with water and the ease of disposal of the cleaning solution, Organic Water
Soluble Fluxes are more frequently being used for electronic soldering applications.
Proper usage can yield very efficient, fast and cost reducing high production soldering
where residue are removed.
Halide Free Organic Water Soluble
Fluxes
HG 1081-HF
Specially formulated material for soldering
copper, nickel-plated and kovar based metal. It has a wide operating temperature range and
exhibits excellent solderability with lowest ionic residue after aqueous cleaning.
HG
1085-HF
Effective soldering of copper, tin-plate and
nickel plate. Ideal for automatic lead tinning operations. Free of corrosive halide.
Excellent solderability. High reliability after aqueous cleaning.
Neutral Water Soluble
Organic Fluxes
HG 1095-NF
Provides excellent solderability with resultant minimum level of ionic traces
after efficient aqueous cleaning. Highly adaptable to foam application, but can be
brushed, dipped or sprayed. This flux can also be utilised for high speed soldering.
3 No Clean Fluxes
Designed and formulated to meet your diverse soldering needs and according to your
application spray, wave or foam. Our Ozone safe chemistry makes them environmentally
clean. Specially formulated low solids, non-halide ingredients are used resulting in the
elimination of cleaning operations.
No Clean Fluxes
HG 3565
Increased productivity through faster conveyor
speeds and lower defects rates. Eliminates the cleaning process thereby reducing cost of
the soldering operation. Outstanding solderability. Residue do not interfere with
post-solder electrical testing.
No Clean Halide Free Fluxes
HG 3549-HF
The percent solids available are in 5%, 8% and 10%. Passes copper mirror test
per MIL-F-14256. Outstanding solderability on PTH, SMT and mixed technology boards.
4 No Residue Fluxes
Non-halide Rosin/Resin Free formula that leaves no visible residue after soldering.
Assemblies properly fluxed and soldered provide high SIR values. Meets Bellcore
TR-NWT000078 specs. Can be used successfully on hot air leveling, roll-tinned, infrared
fused, rosin based lacquers and organic solderability protective coatings.
HG 3590-10
With solids content of 2%, it contains very effective flux activators which
result in excellent solderability and reduced defects. Compatible with conformal coatings
without cleaning.
5 VOC-Free Fluxes
VOC-Free fluxes are water based and can provide cost saving process control as well as
safer work environment. Non-flammable formulation eliminates fire hazards and special
storage requirements while reducing VOC emissions dramatically. Conforms to Bellcore
Specification TR-NWT-000078 Issue 3 (December 1991).
HG 1076-33
Is non-halide, VOC free, resin free, non-residue flux specially developed for
wave soldering, surface mount, mixed technology and through-hole electronics assemblies.
It has excellent surface wetting and also eliminates cleaning process.
